The rotary table (32) is rotationally connected to the base (31), and the liquid dispensing part (35) is fixed to the rotary table (32).
The rotary table has a third actuator for rotating the rotary table about the vertical axis.
Welding is carried out on the rotary table, and the hole positions are simply marked on the workpiece placed on the rotary table.
The lifters (5) lift the rotary table (6), and the rotary table (6) is brought to the desired position by means of the reducer (3).
The lifters (5) lower the rotary table (6) to its new position, and the lock unit (8) fixed the rotary table (6) at its new position.
The rotating table apparatus comprises a rotating table (10), a support part (20) able to adjust the angle of inclination of the rotating table (10), a retaining plate (30) and fixing sleeve parts (40a, 40b).
Finally; a rotating table  is provided on the frame which has a plurality of work station positions  supporting clamping assemblies  for clamping single cavity molds  around the periphery of the rotating table .
The crushing part (50) is formed by being partitioned by a first rotating table (60) and a second rotating table (70), which are connected to a first rotary shaft (110) or a second rotary shaft (111), respectively.
Wafer polishing apparatus (10) includes turntable (14) having polishing surface (46) thereon, and frame (12) mounting turntable (14) for rotation about axis (16).
A pressure plate (40) mounted by spindle (90) rotates about axis (42) spaced from axis (16) of the turntable (14), but is held from rotation about axis (16) of turntable (14).
The PGA is carried by a rotatable table assembly (10).
The pallet is firmly fixed to a rotatable table in the sputtering chamber.