An electropolishing system that includes electropolishing fixtures.
The method is applicable to the electropolishing of a metal layer under a fixed current or voltage, wherein a voltage current detector is installed in the electropolishing apparatus.
An electropolishing process endpoint detection method is described.
The electropolishing rate at the top of the opening is thereby faster than that at the bottom of the opening.
Because electropolishing is used, polishing avoids removal of softer insulating materials of the integrated circuit.
The metal surfaces of the reservoir and/or valve have been finished by electropolishing.
The electropolishing process is monitored by measuring electrical resistance at the first radial location.
An apparatus and method are provided for simultaneously electropolishing a plurality of metallic stents.
An electropolishing or electroplating system and method for metal conveyor belts is described.
Provided is an electrolytic polishing method for a hollow tube having a variable internal diameter.
Since an electrolytic polishing liquid exhibiting high conductivity is employed, a high electrolytic current level can be attained and the inter-electrode distance can be increased.
An electrolytic polishing fluid (20) introduced between the polishing surface and the metal layer of a wafer forms an electrical circuit between the anode, cathode and the metal layer.
A method of electrolytically polishing metals which are apt to form an oxide film, such as ferritic stainless steel or aluminum alloy, and an electrolytic solution therefor.