In accordance with the invention, a bump is formed on top of a die bond pad by forming a ball bond there.
A resin paste for die bonding which can be easily supplied/applied by a printing method.
Provided is a lead-free solder for die bonding, which has high upper temperature limit and improved wettability characteristics.
The dicing/die bonding tape is provided with a cohesive/adhesive layer, and a non-cohesive layer laminated on the cohesive/adhesive layer.
The present invention is a conductive paste for die bonding, which is composed of a metal powder and an organic solvent.
Also provided is a die-bonding agent comprising the electrically conductive composition.
Disclosed is a conductive connecting member such as a conductive bump composed of a porous metallic body having an excellent heat cycle, and a conductive die-bond unit and the like.