The semiconductor device has the bonded substrate composed of a semiconductor substrate and a different type substrate composed of a material other than that of the semiconductor bonded on the surface of the semiconductor substrate.
Provided are a semiconductor substrate wherein a level of an interface between a semiconductor and an insulating material is reduced, a method for manufacturing the semiconductor substrate and a semiconductor device.
A semiconductor device is formed from a semiconductor substrate (12) and a layer of dielectric material (40) is formed over the semiconductor substrate (40) and the semiconductor device.
A semiconductor device includes a semiconductor substrate 110, a film stack 100 formed on the semiconductor substrate and having a film to be processed (130).
A semiconductor appearance inspecting device for inspecting the appearance of a semiconductor device to be inspected by means of the optical image of the semiconductor device.