A copper plating liquid having the same composition is used for the first embedding copper plating step and the second embedding copper plating step.
A copper plating solution and a method for preparing a copper plating solution are provided.
The method is provided with a two-stage plating step which is composed of a first embedding copper plating step and a second embedding copper plating step.
The electroless copper plating is chemical-mechanical polished, where there is no annealing before the chemical-mechanical polishing and after the simultaneous electroless copper plating and anneal.
The method for copper plating allows a copper plating film being uniform and excellent in adhesion to be formed with stability on the surface of an article to be plated.
A copper electroplating process using alkoxylated dimercaptan ethers as an additive.
In particular, the present invention relates to cooper electroplating in the fabrication of interconnect structures in semiconductor devices.
By use of the inventive copper eletroplating bath composition, the incidence of voids in the interconnect structures is reduced.
The present invention relates to a copper electroplating bath composition and method of using it for microelectronic device fabrication.
The invention relates to starting cathodes made of copper band for copper electrolysis and a method for the production thereof.
This process may be particularly useful for the complex requirements of a dual damascene structure, especially with copper applications.
A method for electro copperplating substrates, using insoluble anodes in acid copper baths and a separate supply of used copper ions.