Disclosed is a copper clad film for manufacturing a copper clad laminate, and a copper clad laminate comprising same.
surface with copper coated protective coating
The lower substrate is made of a rigid copper clad laminate.
Also provided are a copper clad laminate characterized by being obtained by using the surface-processed copper foil, and a printed wiring board characterized by being obtained by using the copper clad laminate.
The present invention provides both a copper foil which imparts excellent bendability when used in copper-clad laminates and a copper-clad laminate which is obtained using the copper foil.
The resulted copper clad laminate satisfies the halogen-free requirement, and has advantages such as excellent resistance to heat and moisture, and low dielectric loss.
The resulting copper-clad dielectric material (12) is removed from the belt (1) as it passes from the second run (4) to a return run (13).
Colorless pixels with a modified refractive index in relation to the surroundings and color pixels, for instance silver yellow and copper ruby, can be produced with the aid of the inventive method.